For more information, please refer to details.

• Al2O3 ,99.6% Hi-Rel + Hybrid grade
  Dimension: 4.5" x 3.75"
  Thickness: 10 - 50 mil
• AlN
  Dimension: 4.5" x 3.75"
  Thickness: 25 - 40 mil

• NiCr-Ni-Au

• Au (purity 99,99% hardness 90 max VHN20)
  Thickness: 3 - 5 µm

Gold deposit meets the requirements of the relevant specification for bonding, soldering and purity. (MIL 883C, MIL 202F, MIL-G-45204C)

Conductors

• Metallization lay-up NiCr-Ni-Au-Au
• Line width Min. 25 ± 4 µm
• Gap width Min. 25 ± 4 µm

• Sheet resistivity 50, 100,200
• Line width
  Not trimmable Min. 100µm
  RF-trimmable Min. 150µm
  Trimmable Min. 250µm
• Line width tolerance ± 2.5 µm
• Gap width Min. 100µm
• Probe pads Min. 300*300 µm2
• Power dissipation
  Rsq 50 Max. 180 mW/mm2
  Rsq 100 Max. 120 mW/mm2
  Rsq 200 Max. 80 mW/mm2

• Hole diameter Min. 300 µm
• Distance between vias Min. 200 µm
• Distance to resistor Min.150 µm
• Vias / inch2 substrate Via 300 µm Max. 18
• Land dimension for via Diameter via + 300µm
• Alignment accuracy ± 50 µm