In the sixties, a beginning was made with the development of printed circuit boards (PCBs) and substrates. Little was known yet on the subject of printed wiring, and Thales Nederland performed a pioneering role in this field. In those days, Thales Nederland manufactured everything itself, including the production machines. The BB&S department, for instance, operated a photo plotter and exposure machine made in-house.
 The product was still in its infancy, but developments went very rapidly. From a bilayer, the product evolved to an assembly comprising 40 layers. With this, Thales Nederland left other printed circuit manufacturers far behind. Thales Nederland further distinguished itself in the areas of thin layers and materials. In 1969 the production department got off the ground. Visual inspection played an important part in that period. Testers examined and checked all layers personally.
In the seventies, Thales Nederland proceeded to buy machines, which enabled it to adapt its plant very specifically to the company's complex requirements. This development yielded machines that could handle thin materials. In those years, too, in cooperation with machine suppliers the manual process was gradually automated.
At the end of the eighties, the product development of foam strip line was started. At the beginning of the development two metres' lengths could be handled, whereas at the moment a maximum length of eight metres is no problem. This ensures a limitation of the electrical losses and considerable economies of weight.
In the beginning of the nineties, the complex product requirements made accuracy a factor of growing importance. In drilling, precision increased, the capacity was expanded and ever smaller holes could be made.
At the end of the nineties, the former multilayer department, together with the substrates activity, was converted into an independent entity, which in the coming years is scheduled to develop into an accountable unit.
The Multi Functional Carrier (MFC) is one of the latest product developments of BB&S. This board integrates digital and HF layers. A unique development, almost unequalled anywhere in the world, providing a strongly integrated functionality and a huge weight saving. Further developments are, for example, the reduction of track widths and vias.
In short: a department with a history, a department with a future.
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